Through hole pads must have soldermask pulled back to allow soldering. However they must not have solderpaste openings as they do not receive solder paste during stencil screening.
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Pads for THT footprints must have the following layers set:
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All copper layers
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F.Mask
(front mask) -
B.Mask
(back mask)
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Pads must not have the silkscreen layers active