The following footprint naming conventions should be used as examples for naming SMD IC package footprints.
If you do not find an appropriate convention that matches a particular footprint type, either contact the KiCad library team or try to match a convention set by existing library components.
In the entries below, variable fields are denoted as follows:
- Fixed fields
- Mandatory fields
- Optional fields
Gullwing Packages
The format below provides a guide for naming Gullwing IC packages.
Examples:
-
SOIC
-
SOP
-
QFP
-
J-Lead
- PKG - Package name
- Pin count - Number of (unique) pins
- EP Qty - Number of exposed pads under the device (if greater than zero) (Optional)
- X - Major dimension of part on x axis
- Y - Major dimension of part on y axis
- Z - Major dimension of part on z axis (Optional)
- Pitch - Lead pitch
- Modifiers - Footprint modifiers (Optional)
- Options - Extra footprint options (Optional)
Example:
Notes:
-
[
PKG
] - refers to the name most commonly used in the industry. Generally this implies JEDEC naming but some other standard may be used as required. -
[
Pin count
] - the number of uniquely numbered pads (excluding any exposed pads under the device) -
[
Modifiers
] - may vary for individual IC footprint types. Includes:-
Clearance
-
Lead size
-
Pad size
-
Exposed pad size
-
Soldermask expansion
-
No-Lead Packages
Examples:
-
DFN
-
QFN
-
LCC
- PKG - Package name
- Pincount - Number of (unique) pins
- EP Qty - Number of exposed pads under the device (if greater than zero) (Optional)
- X - Major dimension of part on x axis
- Y - Major dimension of part on y axis
- Z - Major dimension of part on z axis (Optional)
- Pitch - Lead pitch
- Modifiers - Footprint modifiers (Optional)
- Options - Extra footprint options (Optional)
Example:
Notes:
-
The lead length is the nominal lead length for which the footprint is designed
-
Optionally the nominal lead width can also be provided
Ball Grid Array Packages
- PKG - Package name
- Pincount - Number of (unique) pins
- X - Major dimension of part on x axis
- Y - Major dimension of part on y axis
- Z - Major dimension of part on z axis (Optional)
- Columns - Number of ball columns
- Rows - Number of ball rows
- Pitch X - Ball pitch in x direction
- Pitch Y - Ball pitch in y direction (if different from x direction (Optional)
- Ball - Ball diameter
- Pad - Pad diameter
- NSMD/SMD - Solder Mask Defined or Non Solder Mask Defined
- Modifiers - Footprint modifiers (Optional)
- Options - Extra footprint options (Optional)
Example:
Notes:
-
For BGA simply providing the pin count is not sufficient. It is also necessary to provide the number of [
Columns
] (x direction) and [Rows
] (y direction). -
Some BGA packages have different pitch in x and y directions. If this is the case then both [
Pitch
] dimensions need to be provided -
The [
Ball
] diameter for which the footprint is designed needs to be provided -
[
NSMD/SMD
]-
NSMD means the footprint is designed for
non solder mask defined
(mask cutout is larger than copper pad) -
SMD means the footprint is designed for
solder mask defined
(mask cutout is smaller than copper pad)
-